JPS5756208B2 - - Google Patents
Info
- Publication number
- JPS5756208B2 JPS5756208B2 JP14384379A JP14384379A JPS5756208B2 JP S5756208 B2 JPS5756208 B2 JP S5756208B2 JP 14384379 A JP14384379 A JP 14384379A JP 14384379 A JP14384379 A JP 14384379A JP S5756208 B2 JPS5756208 B2 JP S5756208B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14384379A JPS5667926A (en) | 1979-11-08 | 1979-11-08 | Processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14384379A JPS5667926A (en) | 1979-11-08 | 1979-11-08 | Processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5667926A JPS5667926A (en) | 1981-06-08 |
| JPS5756208B2 true JPS5756208B2 (en]) | 1982-11-29 |
Family
ID=15348233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14384379A Granted JPS5667926A (en) | 1979-11-08 | 1979-11-08 | Processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5667926A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439514U (en]) * | 1990-07-19 | 1992-04-03 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5535687B2 (ja) * | 2010-03-01 | 2014-07-02 | 株式会社荏原製作所 | 基板洗浄方法及び基板洗浄装置 |
-
1979
- 1979-11-08 JP JP14384379A patent/JPS5667926A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439514U (en]) * | 1990-07-19 | 1992-04-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5667926A (en) | 1981-06-08 |